Semiconductors

Table of Contents

Chapter 1: Introduction to Semiconductors

Topics: Electron flow; Semiconductor materials, structure, and doping; Junction diodes; Diode characteristic curves and specifications; LEDs; Photoelectric devices

Learning Objectives:

• Discuss the basic structure of a semiconductor atom and the movement of free electrons and holes.
• Discuss the purification and doping of semi-conductors.
• Describe the p-type region, n-type region, and junction of a pn junction diode.
• Discuss the characteristic curves and specification ratings of a diode.
• Describe the operation of a light-emitting diode, a photoconductive device, and a photovoltaic device.

Chapter 2: Environmental Conditions

Topics: Temperature protection; Static electricity; Wrist straps; Line power conditioning; Radio frequency and electromagnetic interference

Learning Objectives:

• Discuss the importance of various environmental conditions to semiconductor operation.
• Discuss the effect of ESD on semiconductor devices and list several ways of preventing ESD in any work area.
• Discuss the requirements of a static-free workstation, and the proper techniques for using tools at the workstation.
• Describe ways to minimize ESD problems during packing and shipping.
• Explain how power conditioning prevents line power problems.
• Describe ways of preventing damage from radio frequency interference (RFI) and electromagnetic interference (EMI).

Chapter 3: Printed Circuit Boards

Topics: Materials for boards and conductors; Single-, double-sided, and multilayer PCBs; Mounting components; Soldering; PCB connectors

Learning Objectives:

• Discuss the advantages of PCBs over direct wiring.
• Explain why both flexible boards and rigid boards are used for printed circuits, and discuss the advantages and disadvantages of each.
• Explain how single-sided, double-sided, and multilayer boards are made.
• Describe the three classes of surface mount assemblies.
• Compare various soldering methods and discuss the advantages and disadvantages of each.
• Describe PCB connectors and mountings.
• Discuss PCB repair techniques and limitations.

Chapter 4: Transistors and Integrated Circuits

Topics: Transistor purpose and structure; Symbols; Performance curves; Transistor connections, characteristics, and specifications; ICs

Learning Objectives:

• Describe the differences between an npn transistor and a pnp transistor and identify the schematic symbol for each.
• Discuss transistor performance in the active region, saturation region, and cutoff region.
• Explain how the three kinds of transistor connections affect circuit values.
• Discuss four common transistor characteristics.

Chapter 5: Packages and Performance Analysis

Topics: Lead identification; Mounting components; Replacement methods; Maximum ratings; Transistor operating points; characteristics

Learning Objectives:

• Describe several kinds of semiconductor packages.
• Explain how to identify leads.
• Describe methods for mounting components on PCBs and chassis.
• Explain how to use manufacturers' data sheets.
• Discuss the analysis of circuits by Q points and by characteristics.

Request Exam Copies